The UALink Consortium is a Gold sponsor for the upcoming AI Infra Summit, taking place from September 9 – 11 in Santa Clara, CA.
UALink Consortium representatives will support the following activities to highlight the benefits of UALink technology for AI applications:
Technical Deep Dive into the UALink 200G 1.0 Specification, Scale-Up, and Use Cases Panel
- Date and time: Wednesday, September 10, 9:00 – 9:40 am
- Moderator: Peter Onufryk (Intel)
- Panelists: Nafea Bshara (AWS), Amber Huffman (Google), Gaya Nagarajan (Meta)
- Location: Room 201
- Abstract: As AI workload demands continue to accelerate, Cloud Service Providers, System OEMs, and IP/Silicon vendors require a scalable, high-performance solution to support advanced workloads. By enhancing performance, optimizing power and cost efficiency, and promoting interoperability and supply chain diversity, the UALink 200G 1.0 Specification delivers a low-latency, high-bandwidth interconnect designed for efficient communication between accelerators and switches within AI computing pods.
In this session, a panel of UALink experts will explore the latest developments in the UALink 200G 1.0 Specification and demonstrate how it enables scalable, multi-node AI architectures. Attendees will also have the chance to engage directly with the panel to discuss future applications and learn how UALink-enabled systems will lay the foundation for next generation AI/ML systems.
Networking: Transformative Advancements in Ethernet, Photonics, & Optical – Speed, Performance, & Cost Tradeoffs Panel
- Date and time: Wednesday, September 10, 2:40 – 3:20 pm
- Moderator: Kurtis Bowman (AMD)
- Panelists: Charlie Fu (Amphenol), Dave Lazovsky (Celestial), Dudy Cohen (Drivenets) and Ashwin Gumaste (Microsoft)
- Location: Hardware & Systems Room
Booth (#509)
- Meet with UALink representatives to discuss the benefits and applications of UALink technology.
Use code “UALINK15” for a 15% discount off of your registration: https://ai-infra-summit.com/events/ai-infra-summit/register