The UALink Consortium looks forward to participating in the Future of Memory and Storage (FMS) event at the Santa Clara Convention Center from August 5-7, 2025.
UALink Kiosk at the Open Standards Pavilion
- Visit Consortium representatives in booth no. 725 to learn about UALink technology.
UALink Sponsored Speaking Session – August 7 at 9:45 am PT
- Title: UALink™ 200G 1.0 Specification Overview and Applications
- Presenter: Derek Williams (AMD)
- Abstract: As the demand for AI compute grows, Cloud Service Providers, System OEMs, and IP/Silicon Providers need an efficient, optimized solution to address scale-up AI challenges. The UALink 200G 1.0 Specification defines a low-latency, high-bandwidth interconnect for communication between accelerators and switches in AI computing pods. By increasing performance, improving power and cost efficiency and introducing supply chain diversity and interoperability, UALink enables next-generation AI/ML applications. During this session, a UALink panel of experts will highlight the technology’s latest advancements and demonstrate how UALink will help create multi-node systems for AI applications. Attendees will have the opportunity to ask questions about the future applications and benefits of UALink devices.
- Location: Ballroom D, Santa Clara Convention Center
Stay tuned for additional updates!