The UALink Consortium made a significant impression at FMS: The Future of Memory and Storage 2025, held at the Santa Clara Convention Center from August 5-7, 2025. During the event, UALink representatives participated in a variety of activities to demonstrate the importance of UALink technology as the open protocol for AI scale-up. Below, we share an activities recap.
UALink Kiosk in the Open Standards Pavilion
Representatives from the UALink Consortium welcomed attendees at our kiosk, introducing the UALink 200G 1.0 Specification and its applications and use cases for scale-up AI workloads. Consortium members Astera Labs, GigaIO, Marvell, Synopsys and UnifabriX shared UALink video demos in the booth to demonstrate the broad industry support behind the consortium.
Sponsored Speaking Session
Derek Williams (AMD) delivered a compelling presentation titled “UALink 200G 1.0 Specification Overview and Applications.” He provided a technical deep dive into how the specification addresses the growing demands of AI compute infrastructures by enabling a low-latency, high-bandwidth interconnect between accelerators in AI pods. The session provided attendees with details on how UALink enhances performance, power and cost efficiency, and supply chain flexibility while enabling multi-node AI/ML system architectures. Derek also addressed audience questions on the future of UALink technology and the UALink Consortium.
You can view the recording of our presentation and the Q&A on our YouTube channel here.
Recognition as an Industry Standards Innovator
The UALink 200G 1.0 Specification was awarded the “Most Innovative Technology – Industry Standards” award at FMS 2025, underscoring the technology’s pivotal role in shaping open interconnect standards for AI infrastructure.
Willie Nelson, Jim Pappas and Nathan Kalyanasundharam accept the “Most Innovative Technology – Industry Standards” award on behalf of the UALink Consortium at FMS 2025.
“A standards organization was created to address network interconnect for GPU-to-GPU communication, bypassing the CPU and system memory entirely with interoperability across vendors,” said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors, Inc. “We are proud to recognize Ultra Accelerator Link™ (UALink™) 200G 1.0 Specification, a groundbreaking, Ethernet-based interconnect standard specifically engineered to meet the needs of AI, Machine Learning, High-Performance Computing (HPC), and Cloud environments. Developed as a collaborative effort among more than 100 industry-leading members, UALink represents a new class of open interconnect with a high-performance scale-up fabric that sets the foundation for next-generation AI infrastructure.”
Meet with UALink Representatives at the AI Infra Summit
As AI data center technology continues to advance, the UALink Consortium continues to drive open AI scale-up technology.
The UALink Consortium will be participating in numerous activities during the AI Infra Summit, from September 9-11 at the Santa Clara Convention Center. Meet with UALink representatives in our booth (#509) to learn how UALink is creating an open ecosystem for AI scale-up networking. Plus, attend our breakfast briefing panel on Wednesday, September 10 at 9:00 am for a deep dive into UALink technology, with representatives from AWS, Google, Intel and Meta. Learn more about our activities here. Plus, use code UALINK15 for 15% off of your full registration.
We hope to see you in Santa Clara!