At the OCP Global Summit this year, a major talking point was the ongoing growth of AI models and their increasing requirements for compute and memory to efficiently execute training and inference.
UALink Consortium representatives were onsite to highlight the progress of UALink technology, including the development of UALink IP and solutions and the expansion of the in-network collectives (INC), management, and chiplet specifications. As we work to establish an optimized open scale-up ecosystem, we were excited to see the momentum and excitement behind UALink, with over 30 UALink members exhibiting on the show floor and numerous attendees sharing their excitement for UALink.
Speaking Sessions and Panels
UALink technology experts from AMD, Astera Labs, Intel, Synopsys, and UpscaleAI presented a range of ongoing advancements for the UALink 200G 1.0 Specification. The panelists discussed the importance of having an open ecosystem for AI scale-up technology and the numerous benefits UALink solutions will bring to the market. Attendees also gained insights into the organization’s momentum and the essential components needed to deploy a cohesive scale-up system.
Kurtis Bowman, UALink Consortium Chair, also introduced the ongoing collaboration between OCP and UALink and shared an overview of the Consortium’s achievements since its inception in 2024. Attendees got a first-hand look at the UALink roadmap and how it is evolving to meet the escalating computing demands of AI applications.
UALink at the Innovation Village
At the UALink kiosk, Consortium representatives engaged with attendees to share the latest updates on the UALink specification and discuss what’s next for UALink-enabled products. The kiosk provided a space for valuable conversations with industry leaders, researchers, and practitioners, who were excited about the prospect of upcoming UALink solutions and architectures and enthusiastic about the future of AI scale-up. UALink Consortium and our members remain aligned with our mission to unleash the full potential of open, optimized, high-performance, scale-up connectivity to enable transformative AI solutions.
Momentum from Member Announcements
During the event, several UALink member companies shared exciting updates that reflect the growing momentum of UALink technology and solutions. Highlights from these announcements include:
AMD
AMD “Helios’’: Advancing Openness in AI Infrastructure Built on Meta’s 2025 OCP Open Rack for AI Design
AMD continues to lead in open standards like OCP, UALink™, and the Ultra Ethernet Consortium (UEC), enabling industry collaboration to accelerate scalable, high-performance, and energy-efficient AI infrastructure.
“UALink marks a key advancement in enabling open, high-performance connectivity across a range of accelerators and memory architectures,” Robert Hormuth, Corporate Vice President, Architecture and Strategy | Data Center Solutions Group, AMD. “At OCP Global Summit 2025, AMD showcased the ‘Helios’ rack-scale platform, which leverages the UALink open interconnect standard to drive collaborative innovation and deliver scalable, energy-efficient AI infrastructure. Together, these efforts reflect the industry’s progress toward more open and flexible AI systems designed to meet the demands of large-scale workloads.”
Astera Labs
Astera Labs Showcases Rack-Scale AI Ecosystem Momentum at OCP Global Summit
Astera Labs highlighted live demonstrations and technical sessions featuring PCIe, UALink, Ethernet, CXL, and OpenBMC technologies — showcasing broad ecosystem support for open, standards-based AI solutions.
“The UALink ecosystem’s growing maturity and collaboration with OCP highlight the industry’s commitment to scalable, open rack-scale connectivity,” Chris Petersen, Fellow, Technology & Ecosystems, Astera Labs and UALink Consortium Board Member. “Astera Labs champions open standards with purpose-built solutions and multi-vendor ecosystem to drive innovation for AI Infrastructure 2.0. From GPU interoperability to intelligent rack-scale management, we enable connectivity for today’s and tomorrow’s AI workloads.”
Keysight
Keysight Launches Automated Transmitter Compliance Test Solution for New UALink 1.0 Standard
Keysight introduced its new UALink 1.0 compliance test solution at the 2025 OCP Global Summit (booth #C1), demonstrating automated validation capabilities for the evolving UALink ecosystem.
“The introduction of UALink marks a transformative leap in AI infrastructure and directly addresses the lack of an open, industry-standard, high-bandwidth low-latency interconnect for scaling AI accelerators within data centers,” said Dr. Joachim Peerlings, Vice President of Network and Data Center Solutions at Keysight Technologies. “By providing tools for validating UALink transmitters, Keysight is helping the industry accelerate the introduction of products based on the open UALink standard.”
Looking Ahead to SC25
We’re looking forward to sharing additional updates on UALink technology at Supercomputing 2025 (SC25), taking place November 16–21 in St. Louis, MO.UALink will be featured in the SNIA Open Standards Pavilion (Booth no. 211) and will host a Birds of a Feather session exploring AI scale-up networking advancements.
We look forward to connecting with the community once again at SC25 as we continue to drive open, collaborative innovation for the AI era. If you will be attending SC25 and would like to schedule a meeting with a UALink representative, please contact ualink@nereus-worldwide.com.
See you in St. Louis!