The UALink Consortium is proud to be a Gold sponsor of the AI Infra Summit, taking place September 9–11 in Santa Clara, California. The event brings together experts and innovators shaping the infrastructure that powers today’s AI workloads. During the event, UALink representatives will be on-site to showcase how UALink technology is driving the future of scalable, high-performance AI systems.
Discover UALink at the Summit
UALink Consortium representatives will participate in several key activities during the event, offering valuable insights into the applications and use cases of UALink technology. Keep reading to learn more about our activities:
Technical Deep Dive: UALink 200G 1.0 Specification, Scale-Up, and Use Cases
- Date & Time: Wednesday, September 10 | 9:00 – 9:40 AM
- Location: Room 201
- Moderator: Amber Huffman (Google)
- Panelists:
- Nafea Bshara (AWS)
- Peter Onufryk (Intel)
- Gaya Nagarajan (Meta)
- Abstract: Dive into the technical details of the UALink 200G 1.0 specification and explore how UALink, the open protocol for AI scale-up networking, enables scalable, high-performance connectivity for next-gen AI infrastructure.
Networking Panel: Transformative Advancements in Ethernet, Photonics, & Optical – Speed, Performance, & Cost Tradeoffs
- Date & Time: Wednesday, September 10 | 2:40 – 3:20 PM
- Location: Hardware & Systems Room
- Moderator: Kurtis Bowman (AMD)
- Panelists:
- Charlie Fu (Amphenol)
- Dave Lazovsky (Celestial)
- Dudy Cohen (Drivenets)
- Ashwin Gumaste (Microsoft)
- Abstract: This expert panel will examine the latest networking innovations and their impact on AI infrastructure—from performance gains to cost efficiencies.
Plus, stop by the UALink Consortium booth (#509) to meet with UALink representatives and explore the new possibilities for AI applications with UALink.
Finally, if you are interested in attending the event, use code UALINK15 for 15% off your registration: Register for the AI Infra Summit
We look forward to seeing you in Santa Clara!