The UALink Consortium is excited to participate as an Organizational sponsor of the upcoming FMS: the Future of Memory and Storage 2025 event from August 5-7 in Santa Clara, CA. UALink representatives will be on-site to highlight the important applications and use cases for UALink technology in AI scale-up architectures.
Join us at the following activities:
- UALink Sponsored Presentation Session
- Title: UALink™ 200G 1.0 Specification Overview and Applications
- Date and Time: Thursday, August 7, from 9:45 – 10:50 am PT
- Location: Ballroom D
- Presenter: Derek Williams
- Description: As the demand for AI compute grows, Cloud Service Providers, System OEMs, and IP/Silicon Providers need an efficient, optimized solution to address scale-up AI challenges. The UALink 200G 1.0 Specification defines a low-latency, high-bandwidth interconnect for communication between accelerators and switches in AI computing pods. By increasing performance, improving power and cost efficiency and introducing supply chain diversity and interoperability, UALink enables next-generation AI/ML applications. During this session, a UALink panel of experts will highlight the technology’s latest advancements and demonstrate how UALink will help create multi-node systems for AI applications. Attendees will have the opportunity to ask questions about the future applications and benefits of UALink devices.
- Open Standards Pavilion Kiosk
- Meet with UALink representatives in booth 725D to learn more about UALink technology applications and use cases.
Register for FMS 2025 today to participate to learn directly from the experts behind UALink technology’s development.
Contact ualink@nereus-worldwide.com to schedule a meeting with UALink Consortium representatives.
View the event agenda for more information and make sure to follow the UALink Consortium on LinkedIn, X and Bluesky for updates.